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Freescale Semiconductor Technical Data
MPX4100 Rev 7, 12/2006
Integrated Silicon Pressure Sensor Manifold Absolute Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
The MPX4100 series Manifold Absolute Pressure (MAP) sensor for engine control is designed to sense absolute air pressure within the intake manifold. This measurement can be used to compute the amount of fuel required for each cylinder. The small form factor and high reliability of on-chip integration makes the MAP sensor a logical and economical choice for automotive system designers. Features * * * * * * 1.8% Maximum Error Over 0 to 85C Specifically Designed for Intake Manifold Absolute Pressure Sensing in Engine Control Systems Ideally Suited for Microprocessor Interfacing Temperature Compensated Over -40C to +125C Durable Epoxy Unibody Element Ideal for Non-Automotive Applications
MPX4100 SERIES
INTEGRATED PRESSURE SENSOR 20 TO 105 kPA (2.9 TO 15.2 psi) 0.3 TO 4.9 V OUTPUT
MPX4100A CASE 867-08
MPX4100AP CASE 867B-04
Typical Applications * Manifold Sensing for Automotive Systems
ORDERING INFORMATION(1)
Device Type Basic Element Options Absolute, Element Only Case No. 867-08 867B-04 867E-03 867F-03 MPX Series Order Number MPX4100A MPX4100AP MPX4100AS MPX4100ASX Device Marking MPX4100A MPX4100AP MPX4100A MPX4100A MPX4100ASX CASE 867F-03 MPX4100AS CASE 867E-03
Ported Elements Absolute, Ported Absolute, Stove Pipe Port Absolute, Axial Port
1. The MPX4100A series MAP silicon pressure sensors are available in the Basic Element, or with pressure port fittings that provide mounting ease and barbed hose connections.
PIN NUMBERS
1 2 3 VOUT GND VS 4 5 6 NC NC NC
(c) Freescale Semiconductor, Inc., 2006. All rights reserved.
The MPX4100 series piezoresistive transducer is a stateof-the-art, monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced micromachining techniques, thin film metallization, and bipolar semiconductor
processing to provide an accurate, high level analog output signal that is proportional to applied pressure. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
VS
Sensing Element
Thin Film Temperature Compensation and Gain Stage #1
Gain Stage #2 and Ground Reference Shift Circuitry
VOUT
Pins 4, 5, and 6 are NO CONNECTS GND
Figure 1. Fully Integrated Pressure Sensor Schematic Table 1. MAXIMUM RATINGS
(2)
(1)
Rating Overpressure (P1 > P2)
Symbol Pmax Pburst Tstg TA
Value 400 1000 -40 to +125 -40 to +125
Unit kPa kPa C C
Burst Pressure(2) (P1 > P2) Storage Temperature Operating Temperature 1. TC = 25C unless otherwise noted.
2. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
MPX4100 2 Sensors Freescale Semiconductor
Table 2. OPERATING CHARACTERISTICS (VS = 5.1 Vdc, TA = 25xC unless otherwise noted, P1 > P2)
Characteristic(1) Pressure Range(2) Supply Voltage(2) Symbol POP VS IO (0 to 85C) (0 to 85C) (0 to 85C) (0 to 85C) Voff VFSO VFSS -- V/P tR IO+ -- -- Min 20 4.85 -- 0.225 4.815 -- -- -- -- -- -- -- Typ -- 5.1 7.0 0.306 4.897 4.59 -- 54 1.0 0.1 20 0.5 Max 105 5.35 10 0.388 4.978 -- 1.8 -- -- -- -- -- Unit kPa Vdc mAdc Vdc Vdc Vdc %VFSS mV/kPa ms mAdc ms %VFSS
Supply Current Minimum Pressure Offset(3) @ VS = 5.1 V Full Scale Output(4) @ VS = 5.1 V Full Scale Span(5) @ VS = 5.1 V Accuracy(6) Sensitivity Response Time(7) Output Source Current at Full Scale Output Warm-Up Time
(8)
Offset Stability(9) (10)
1. Decoupling circuit shown in Figure 3 required to meet electrical specifications. 2. 1.0 kPa (kiloPascal) equals 0.145 psi. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6. Accuracy (error budget) consists of the following: * Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. * Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. * Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25C. * TcSpan: Output deviation over the temperature range of 0 to 85C, relative to 25C. * TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85C, relative to 25C. * Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25C. 7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 8. Warm-up is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 9. Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. 10. Device is ratiometric within this specified excitation range.
Table 3. MECHANICAL CHARACTERISTICS
Characteristic Weight, Basic Element (Case 867) Common Mode Line Pressure(1) Symbol -- -- Min -- -- Typ 4.0 -- Max -- 690 Unit Grams kPa
1. Common mode pressures beyond specified may result in leakage at the case-to-lead interface.
MPX4100 Sensors Freescale Semiconductor 3
Fluoro Silicone Gel Die Coat Wire Bond
Die P1
Stainless Steel Metal Cover
Epoxy Plastic Case
Lead Frame Sealed Vacuum Reference
Absolute Element P2
Die Bond
Figure 2. Cross-Sectional Diagram (Not to Scale)
+5.0 V
1 3 1.0 F 0.01 F IPS 2
OUTPUT
Figure 3. Recommended Power Supply Decoupling (For output filtering recommendations, refer to Application Note AN1646.) Figure 2 illustrates an absolute sensing chip in the basic chip carrier (Case 867). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The MPX4100A series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Figure 4 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0 to 85C. (The output will saturate outside of the specified pressure range.)
5.0 4.5 4.0 3.5 3.0 Output (Volts) 2.5 2.0 1.5 1.0 0.5 0
Transfer Function: VOUT = Vs* (.01059*P-.152) Error VS = 5.1 Vdc TEMP = 0 to 85C 20 kPa TO 105 kPa MAX MPX4100A
TYP
MIN
MPX4100 4 Sensors Freescale Semiconductor
5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 105 110 Pressure (ref. to sealed vacuum) in kPa
Figure 4. Output versus Absolute Pressure
Transfer Function (MPX4100A) Nominal Transfer Value:
Vout = VS (P x 0.01059 - 0.1518) (Pressure Error x Temp. Factor x 0.01059 x VS) VS = 5.1 V 0.25 Vdc
Temperature Error Band MPX4100A Series
4.0 3.0 Temperature Error Factor 2.0 1.0 0.0 -40 -20 0 20 40 60 80 100 120 140 Temperature in Cx Temp - 40 0 to 85 +125 Multiplier 3 1 3
Pressure Error Band
3.0 2.0 Pressure Error (kPa) 1.0 0.0 -1.0 -2.0 -3.0 20
Error Limits for Pressure
40
60
80
100
120
Pressure (in kPa)
Pressure 20 to 105 (kPa)
Error (Max) 1.5 (kPa)
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
The two sides of the pressure sensor are designated as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluorosilicone gel, which protects the die from harsh media. The MPX pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below:
Part Number MPX4100A MPX4100AP MPX4100AS MPX4100ASX Case Type 867 867B 867E 867F Pressure (P1) Side Identifier Stainless Steel Cap Side with Port Marking Side with Port Attached Side with Port Attached
MPX4100 Sensors Freescale Semiconductor 5
PACKAGE DIMENSIONS
C R M B -AN
PIN 1 SEATING PLANE
1 2 3 4 5 6
POSITIVE PRESSURE (P1)
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630).
INCHES MILLIMETERS MAX MIN MAX MIN 16.00 0.595 0.630 15.11 13.56 0.514 0.534 13.06 5.59 0.200 0.220 5.08 0.84 0.027 0.033 0.68 1.63 0.048 0.064 1.22 0.100 BSC 2.54 BSC 0.40 0.014 0.016 0.36 18.42 0.695 0.725 17.65 30 NOM 30 NOM 12.57 0.475 0.495 12.07 11.43 0.430 0.450 10.92 0.090 0.105 2.29 2.66
L
-TG F D 6 PL 0.136 (0.005)
M
J S
TA
M
DIM A B C D F G J L M N R S OPEN GROUND +VOUT +VSUPPLY -VOUT 6. OPEN
STYLE 1: PIN 1. 2. 3. 4. 5. 6.
VOUT GROUND VCC V1 V2 VEX
3: CASE 867-08 STYLE 1. OPEN PIN GROUND 2. ISSUE N -VOUT 3. VSUPPLY BASIC ELEMENT (A, D) 4. +VOUT 5. STYLE 2: PIN 1. 2. 3. 4. 5. 6. OPEN
CASE 867-O8 ISSUE N BASIC ELEMENT
MPX4100 6 Sensors Freescale Semiconductor
PACKAGE DIMENSIONS
C
A
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH.
INCHES MILLIMETERS MAX MIN MAX MIN 18.28 0.720 17.53 0.690 6.48 6.22 0.245 0.255 20.82 0.780 0.820 19.81 0.84 0.69 0.027 0.033 4.72 4.52 0.178 0.186 1.63 1.22 0.048 0.064 0.100 BSC 2.54 BSC 0.41 0.36 0.014 0.016 9.53 8.76 0.375 0.345 7.87 7.62 0.300 0.310 6.10 5.59 0.220 0.240 4.93 4.62 0.194 0.182 STYLE 1: PIN 1. 2. 3. 4. 5. 6.
-B-
V
PIN 1
PORT #1 POSITIVE PRESSURE (P1)
6
5
4
3
2
1
K
S G F D 6 PL 0.13 (0.005)
M
J N E -T-
DIM A B C D E F G J K N S V
TB
M
VOUT GROUND VCC V1 V2 VEX
CASE 867E-O3 ISSUE D STOVE PIPE PORT (AS)
-TC E A U -Q-
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH.
DIM A B C D E F G J K N P Q R S U V INCHES MILLIMETERS MAX MIN MIN MAX 28.45 27.43 1.080 1.120 19.30 18.80 0.740 0.760 16.51 16.00 0.630 0.650 0.84 0.68 0.027 0.033 4.57 4.06 0.160 0.180 1.63 1.22 0.048 0.064 0.100 BSC 2.54 BSC 0.41 0.36 0.014 0.016 6.10 5.59 0.220 0.240 2.03 1.78 0.070 0.080 4.06 3.81 0.150 0.160 4.06 3.81 0.150 0.160 11.68 11.18 0.440 0.460 18.42 17.65 0.695 0.725 21.84 21.34 0.840 0.860 4.93 4.62 0.182 0.194 STYLE 1: PIN 1. 2. 3. 4. 5. 6.
V
N B R
PORT #1 POSITIVE PRESSURE (P1)
PIN 1
-P0.25 (0.010)
M
TQ
M
6
5
4
3
2
1
S K J 0.13 (0.005)
M
TP
S
D 6 PL QS F
G
VOUT GROUND VCC V1 V2 VEX
CASE 867F-03 ISSUE D AXIAL PORT (ASX)
MPX4100 Sensors Freescale Semiconductor 7
PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 867B-04 ISSUE G PORTED (AP)
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PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 867B-04 ISSUE G PORTED (AP)
MPX4100 Sensors Freescale Semiconductor 9
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MPX4100 Rev. 7 12/2006

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